In situ curing and bonding of epoxy prepregs in epoxy thermoset injection molding

Abstract In this study, epoxy molding compounds are combined with fast-curing prepregs in thermoset injection using a new integrative process. The combination is carried out under the varied parameters of mold temperatures and curing times, which dominant factors processing. focus investigations bond strength interface resulting from these parameters, as known weak point hybrid components. To identify causes for possible increases decreases strength, additional rheological thermoanalytical analyses done near-process conditions. influence prepreg pre-crosslinking, function temperature, also described by means tests specific pre-crosslinking adjusted temperature storage then functionalized process combination. aim study to understand initial limits potential window.